Line-up of self-bonding layer for wire use on HDD, VCM

LOCK Y5 Polyamide (Smooth surface, high-temperature hot air, electric current type)

Features

・Polyamide based bonding layer.
・Uniformity in surface smoothness facilitates array winding.
・General bonding film for current HDD, VCM
・Electric current is also good for fusing.
・Heating temp : 160 to 180℃

LOCK Y7 Polyamide (Smooth surface, high-temperature hot air type)

Features

・Polyamide based bonding layer.。
・Higher than LOCK Y5 in heat resistance.
・Uniformity in surface smoothness facilitates array winding.
・Heating temp : 170 to 190℃

LOCK Y9 Polyamide (Smooth surface, high-temperature hot air type)

Features

・Polyamide based bonding layer.
・Latest line-up of bonding film and higher than LOCK Y7 in heat resistance.
・Uniformity in surface smoothness facilitates array winding.
・Heating temp : 190 to 210℃

LOCK GT Polyamide (High-temperature hot air type)

Features

・Polyamide based bonding layer.
・Excellent resistance to heat.
・Heating temp : 210 to 230℃

*Conductor can be chosen from Copper, Aluminum, CCAW, and HCCAW.
*Normally used with polyester-imide insulating film (SF.EI).

Comparative Characteristics Table

Code	LOCK Y5	LOCK Y7 (LOCK MC)	LOCK Y9	LOCK GT
Windability	◎	◎	○	△
Heat-Bonding	◎	◎	◎	○
Heat Resistance	○	○	◎	◎

Bonding Strength of Self-Bonding Magnet Wires

Bonding Strength at elevated temperature

※This data sheet is a reference value, and no one to guarantee the characteristic

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